Influence of Analog and Digital Crease Lines on Mechanical Parameters of Corrugated Board and Packaging
When producing packaging from corrugated board, material weakening often occurs both during the die-cutting process and during printing. While the analog lamination and/or printing processes that degrade material can be easily replaced with a digital approach, the die-cutting process remains overwhe...
| मुख्य लेखकों: | , , |
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| स्वरूप: | लेख |
| भाषा: | English |
| प्रकाशित: |
MDPI AG
2022-06-01
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| श्रृंखला: | Sensors |
| विषय: | |
| ऑनलाइन पहुंच: | https://www.mdpi.com/1424-8220/22/13/4800 |