Measurement of Wafer Focus by Grating Shearing Interferometry
A method applied for improving the measurement precision and efficiency of wafer focusing in an optical lithography instrument (OLI) is introduced. Based on grating shearing interferometry, the defocus and tilt of the wafer are measured by testing the phase difference in the interference pattern. To...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2020-10-01
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| Series: | Applied Sciences |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2076-3417/10/21/7467 |