Measurement of Wafer Focus by Grating Shearing Interferometry

A method applied for improving the measurement precision and efficiency of wafer focusing in an optical lithography instrument (OLI) is introduced. Based on grating shearing interferometry, the defocus and tilt of the wafer are measured by testing the phase difference in the interference pattern. To...

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Main Authors: Jian Wang, Song Hu, Xianchang Zhu
Format: Article
Language:English
Published: MDPI AG 2020-10-01
Series:Applied Sciences
Subjects:
Online Access:https://www.mdpi.com/2076-3417/10/21/7467
_version_ 1797549954112159744
author Jian Wang
Song Hu
Xianchang Zhu
author_facet Jian Wang
Song Hu
Xianchang Zhu
author_sort Jian Wang
collection DOAJ
description A method applied for improving the measurement precision and efficiency of wafer focusing in an optical lithography instrument (OLI) is introduced. Based on grating shearing interferometry, the defocus and tilt of the wafer are measured by testing the phase difference in the interference pattern. To validate the feasibility, an experiment is implemented, of which the measurement precision is indicated as 30 nm due to the high precision of phase-resolving arithmetic after analyzing the measurement uncertainty and indicating the precision by interferometer.
first_indexed 2024-03-10T15:22:22Z
format Article
id doaj.art-13f1eaced9cb4dcfb7f49216e48d8b25
institution Directory Open Access Journal
issn 2076-3417
language English
last_indexed 2024-03-10T15:22:22Z
publishDate 2020-10-01
publisher MDPI AG
record_format Article
series Applied Sciences
spelling doaj.art-13f1eaced9cb4dcfb7f49216e48d8b252023-11-20T18:20:14ZengMDPI AGApplied Sciences2076-34172020-10-011021746710.3390/app10217467Measurement of Wafer Focus by Grating Shearing InterferometryJian Wang0Song Hu1Xianchang Zhu2University of The Chinese Academy of Science, Beijing 100864, ChinaInstitute of Optics and Electronics, The Chinese Academy of Science, Chengdu 610209, ChinaInstitute of Optics and Electronics, The Chinese Academy of Science, Chengdu 610209, ChinaA method applied for improving the measurement precision and efficiency of wafer focusing in an optical lithography instrument (OLI) is introduced. Based on grating shearing interferometry, the defocus and tilt of the wafer are measured by testing the phase difference in the interference pattern. To validate the feasibility, an experiment is implemented, of which the measurement precision is indicated as 30 nm due to the high precision of phase-resolving arithmetic after analyzing the measurement uncertainty and indicating the precision by interferometer.https://www.mdpi.com/2076-3417/10/21/7467focusinggratingshearing interferometrylithography
spellingShingle Jian Wang
Song Hu
Xianchang Zhu
Measurement of Wafer Focus by Grating Shearing Interferometry
Applied Sciences
focusing
grating
shearing interferometry
lithography
title Measurement of Wafer Focus by Grating Shearing Interferometry
title_full Measurement of Wafer Focus by Grating Shearing Interferometry
title_fullStr Measurement of Wafer Focus by Grating Shearing Interferometry
title_full_unstemmed Measurement of Wafer Focus by Grating Shearing Interferometry
title_short Measurement of Wafer Focus by Grating Shearing Interferometry
title_sort measurement of wafer focus by grating shearing interferometry
topic focusing
grating
shearing interferometry
lithography
url https://www.mdpi.com/2076-3417/10/21/7467
work_keys_str_mv AT jianwang measurementofwaferfocusbygratingshearinginterferometry
AT songhu measurementofwaferfocusbygratingshearinginterferometry
AT xianchangzhu measurementofwaferfocusbygratingshearinginterferometry