Study on interface structure and thermal conductivity regulation of Cu–In composite thermal interface materials

Study on interface structure and thermal conductivity regulation of Cu–In composite thermal interface materials

In foil has excellent heat dissipation performance as a commercially available thermal interface material for high power devices. In order to improve the heat transfer performance of In-based thermal interface materials, a composite thermal interface material with In as the matrix and Cu as the rein...

Szczegółowa specyfikacja

Opis bibliograficzny
Główni autorzy: Jie Zhang, Nan Wu, Hong Guo, Zhongnan Xie, Mingmei Sun, Hui Yang, Ximin Zhang, Yulin Liu, Xinbo He
Format: Artykuł
Język:English
Wydane: Elsevier 2025-01-01
Seria:Journal of Materials Research and Technology
Hasła przedmiotowe:
Thermal interface material
Cu–In composite materials
Hot press sintering
Interface regulation
Thermal conductivity
Dostęp online:http://www.sciencedirect.com/science/article/pii/S2238785424029077

Internet

http://www.sciencedirect.com/science/article/pii/S2238785424029077

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