Review of microstructure and properties of low temperature lead-free solder in electronic packaging

Review of microstructure and properties of low temperature lead-free solder in electronic packaging

Low temperature solder (In-based, Sn-Bi, Sn-Zn) has great advantages in aerospace and through-hole technology assemblies in IBM mainframe due to its unique low temperature characteristics. The review evaluates the effects of alloying elements, rare earth elements and nanoparticles on the wettability...

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Bibliographic Details
Main Authors: Kai-Kai Xu, Liang Zhang, Li-Li Gao, Nan Jiang, Lei Zhang, Su-Juan Zhong
Format: Article
Language:English
Published: Taylor & Francis Group 2020-01-01
Series:Science and Technology of Advanced Materials
Subjects:
low temperature solder
wettability
microstructure
mechanical properties
oxidation resistance
Online Access:http://dx.doi.org/10.1080/14686996.2020.1824255

Internet

http://dx.doi.org/10.1080/14686996.2020.1824255

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