Review of microstructure and properties of low temperature lead-free solder in electronic packaging
Low temperature solder (In-based, Sn-Bi, Sn-Zn) has great advantages in aerospace and through-hole technology assemblies in IBM mainframe due to its unique low temperature characteristics. The review evaluates the effects of alloying elements, rare earth elements and nanoparticles on the wettability...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Taylor & Francis Group
2020-01-01
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| Series: | Science and Technology of Advanced Materials |
| Subjects: | |
| Online Access: | http://dx.doi.org/10.1080/14686996.2020.1824255 |
| _version_ | 1818940313119490048 |
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| author | Kai-Kai Xu Liang Zhang Li-Li Gao Nan Jiang Lei Zhang Su-Juan Zhong |
| author_facet | Kai-Kai Xu Liang Zhang Li-Li Gao Nan Jiang Lei Zhang Su-Juan Zhong |
| author_sort | Kai-Kai Xu |
| collection | DOAJ |
| description | Low temperature solder (In-based, Sn-Bi, Sn-Zn) has great advantages in aerospace and through-hole technology assemblies in IBM mainframe due to its unique low temperature characteristics. The review evaluates the effects of alloying elements, rare earth elements and nanoparticles on the wettability, microstructure, mechanical properties and oxidation resistance of the low-temperature solders. |
| first_indexed | 2024-12-20T06:37:39Z |
| format | Article |
| id | doaj.art-14506c1325be4474a5a46df46d0f8972 |
| institution | Directory Open Access Journal |
| issn | 1468-6996 1878-5514 |
| language | English |
| last_indexed | 2024-12-20T06:37:39Z |
| publishDate | 2020-01-01 |
| publisher | Taylor & Francis Group |
| record_format | Article |
| series | Science and Technology of Advanced Materials |
| spelling | doaj.art-14506c1325be4474a5a46df46d0f89722022-12-21T19:49:57ZengTaylor & Francis GroupScience and Technology of Advanced Materials1468-69961878-55142020-01-0121168971110.1080/14686996.2020.18242551824255Review of microstructure and properties of low temperature lead-free solder in electronic packagingKai-Kai Xu0Liang Zhang1Li-Li Gao2Nan Jiang3Lei Zhang4Su-Juan Zhong5Jiangsu Normal UniversityJiangsu Normal UniversityShanghai Institute of Radio Equipment, Shanghai Institute, Shanghai, ChinaJiangsu Normal UniversityZhengzhou Research Institute of Mechanical EngineeringZhengzhou Research Institute of Mechanical EngineeringLow temperature solder (In-based, Sn-Bi, Sn-Zn) has great advantages in aerospace and through-hole technology assemblies in IBM mainframe due to its unique low temperature characteristics. The review evaluates the effects of alloying elements, rare earth elements and nanoparticles on the wettability, microstructure, mechanical properties and oxidation resistance of the low-temperature solders.http://dx.doi.org/10.1080/14686996.2020.1824255low temperature solderwettabilitymicrostructuremechanical propertiesoxidation resistance |
| spellingShingle | Kai-Kai Xu Liang Zhang Li-Li Gao Nan Jiang Lei Zhang Su-Juan Zhong Review of microstructure and properties of low temperature lead-free solder in electronic packaging Science and Technology of Advanced Materials low temperature solder wettability microstructure mechanical properties oxidation resistance |
| title | Review of microstructure and properties of low temperature lead-free solder in electronic packaging |
| title_full | Review of microstructure and properties of low temperature lead-free solder in electronic packaging |
| title_fullStr | Review of microstructure and properties of low temperature lead-free solder in electronic packaging |
| title_full_unstemmed | Review of microstructure and properties of low temperature lead-free solder in electronic packaging |
| title_short | Review of microstructure and properties of low temperature lead-free solder in electronic packaging |
| title_sort | review of microstructure and properties of low temperature lead free solder in electronic packaging |
| topic | low temperature solder wettability microstructure mechanical properties oxidation resistance |
| url | http://dx.doi.org/10.1080/14686996.2020.1824255 |
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