Review of microstructure and properties of low temperature lead-free solder in electronic packaging

Review of microstructure and properties of low temperature lead-free solder in electronic packaging

Low temperature solder (In-based, Sn-Bi, Sn-Zn) has great advantages in aerospace and through-hole technology assemblies in IBM mainframe due to its unique low temperature characteristics. The review evaluates the effects of alloying elements, rare earth elements and nanoparticles on the wettability...

Full description

Bibliographic Details
Main Authors:	Kai-Kai Xu, Liang Zhang, Li-Li Gao, Nan Jiang, Lei Zhang, Su-Juan Zhong
Format:	Article
Language:	English
Published:	Taylor & Francis Group 2020-01-01
Series:	Science and Technology of Advanced Materials
Subjects:	low temperature solder wettability microstructure mechanical properties oxidation resistance
Online Access:	http://dx.doi.org/10.1080/14686996.2020.1824255

Similar Items

Influence of Ceramic Particles on the Microstructure and Mechanical Properties of SAC305 Lead-Free Soldering Material
by: Manoj Kumar Pal, et al.
Published: (2019-06-01)

Effect of Nanoparticles Addition on the Microstructure and Properties of Lead-Free Solders: A Review
by: Peng Zhang, et al.
Published: (2019-05-01)

A Short Review on the Influence of Antimony Addition to the Microstructure and Thermal Properties of Lead-Free Solder Alloy
by: Nur Syahirah Mohamad Zaimi, et al.
Published: (2023-09-01)

Lead-free soldering /
by: Bath, Jasbir Singh
Published: (2007)

The grain refinements effect of Zn alloying on low-temperature Sn–Bi–In lead-free solder
by: Sunwu Xu, et al.
Published: (2024-03-01)

Interfacial reactions during soldering of lead-free solders on copper and nickel substrates /
by: Siti Rabiatull Aisha Idris, 1983-, et al.
Published: (2012)

Microstructure and morphology of the soldering interface of Sn–2.0Ag–1.5Zn low Ag content lead-free solder ball and different substrates
by: Jin Xiao, et al.
Published: (2023-02-01)

Microstructural Aspects of Fatigue Parameters of Lead-Free Sn-Zn Solders with Various Zn Content
by: Pietrzak K., et al.
Published: (2017-03-01)

Interfacial reactions during soldering of lead-free solders on copper and nickel substrates [electronic resource] /
by: 288113 Siti Rabiatull Aisha Idris
Published: (2012)

Interfacial reactions during soldering between lead-free solders and immersion silver surface finish /
by: Tyah, Jun Hao, 1985-, et al.
Published: (2009)

Deformation response of lead-free solder /
by: 288646 Koh, Ching Theng
Published: (2005)

The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-<i>x</i>Sb High-Temperature Lead-Free Solder
by: Chaojun Li, et al.
Published: (2020-10-01)

EFFECT OF BISMUTH CONTENT ON MICROSTRUCTURE, MELTING TEMPERATURE AND UNDERCOOLING OF SN-0.7CU SOLDER ALLOY
by: Mohd Izrul Izwan RAMLI, et al.
Published: (2018-12-01)

Morphological and mechanical characterisation of BI-AG alloy as high temperature lead free solder
by: Nahavandi, Mahdi
Published: (2014)

Study of Wettability and Solderability of SiC Ceramics with Ni by Use of Sn-Sb-Ti Solder by Heating with Electron Beam in Vacuum
by: Roman Kolenak, et al.
Published: (2022-08-01)

Interfacial reactions during soldering between lead-free solders and immersion silver surface finish [electronic resource] /
by: Tyah, Jun Hao, 1985-
Published: (2009)

Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding, and Mechanical Characteristics
by: Hyejun Kang, et al.
Published: (2021-02-01)

Reliability of SnPbSb/Cu Solder Joint in the High-Temperature Application
by: Jiachen Xu, et al.
Published: (2022-11-01)

The interfacial reactions between lead-free solder and immersion silver finish /
by: Nor Afiza Khamis, 1985-, et al.
Published: (2008)

Experimental Study on the Melting Temperature, Microstructural and Improved Mechanical Properties of Sn58Bi/Cu Solder Alloy Reinforced with 1%, 2% and 3% Zirconia (ZrO2) Nanoparticles
by: S. Amares, et al.
Published: (2021-05-01)

Bismuth-argentum alloys as alternative high temperature lead-free solder
by: Rosilli, Rohaizuan
Published: (2012)

Deformation response of lead-free solder [compact disc] /
by: 288646 Koh, Ching Theng
Published: (2005)

Analysis of Microstructure and Mechanical Properties of Bismuth-Doped SAC305 Lead-Free Solder Alloy at High Temperature
by: Umair Ali, et al.
Published: (2021-07-01)

Intermetallic formation during soldering between lead-free solders and immersion silver surface finish /
by: Ch'ng, Emily Huey Ling, 1984-, et al.
Published: (2007)

A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly
by: Lingyao Sun, et al.
Published: (2022-05-01)

Lead-free soldering in electronics : science, technology and environmental impact /
by: Katsuaki Suganuma
Published: (2004)

The interfacial reactions between lead-free solder and immersion silver finish [electronic resource] /
by: Nor Afiza Khamis, 1985-, et al.
Published: (2008)

Critical Review of Size Effects on Microstructure and Mechanical Properties of Solder Joints for Electronic Packaging
by: Shaobin Wang, et al.
Published: (2019-01-01)

Interfacial reaction during soldering of Sn-Ag-Cu lead free solders on immersion silver and electroless nickel /immersion gold surface finishes /
by: 183648 Ali Ourdjini, et al.
Published: (2007)

Study of interfacial reation during reflow soldering of Sn- Ag - Cu lead - free solders on bare copper and immersion silver surface finishes /
by: Nurfazlin Abu Hassan, 1984-, et al.
Published: (2009)

Sn-0.7Cu-10Bi Solder Modification Strategy by Cr Addition
by: Pin Han, et al.
Published: (2022-10-01)

Intermetallic formation during soldering between lead-free solders and immersion silver surface finish / [compact disc]
by: Ch'ng, Emily Huey Ling, 1984-
Published: (2007)

Creep-fatigue life evaluation of Sn-3.5Ag lead-free solder at low temperatures
by: Noritake HIYOSHI
Published: (2016-05-01)

Investigation of Multicomponent Lead-Free Solders
by: Gyenes A., et al.
Published: (2017-06-01)

Effects on the microstructure and mechanical properties of Sn-0.7Cu lead-free solder with the addition of a small amount of magnesium
by: Huang Her-Yueh, et al.
Published: (2016-11-01)

Study of interfacial reation during reflow soldering of Sn- Ag - Cu lead - free solders on bare copper and immersion silver surface finishes [electronic resource] /
by: Nurfazlin Abu Hassan, 1984-, et al.
Published: (2009)

Preparation and performance of Sn-based composite solder joints by solid-liquid low-temperature solder bonding technology
by: Xuefeng Wu, et al.
Published: (2023-05-01)

Mechanics of solder/IMC interface of lead-free solder interconnects in ball grid array assembly
by: S.F.M. Asasaari, et al.
Published: (2022-03-01)

Lead-free solder interconnect reliability /
by: Shangguan, Dongkai, 1963-
Published: (2005)

Fluxless ultrasonic soldering of SiC ceramics and Cu by Bi–Ag–Ti based solder
by: Daniela Šuryová, et al.
Published: (2020-03-01)