Microstructure and brazing properties of a novel Ag–Cu-Ga solder
In this study, a novel low-silver Ag-xCu-5Ga (x = 28, 34, 39, 49 and 55) solder with high strength was designed and prepared. The effect of element composition on microstructure evolution, thermal behavior, and the mechanical performance of Ag–Cu-Ga solders were investigated in detail. The results i...
| Main Authors: | , , , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2023-03-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785423001096 |