Micromorphology change and microstructure of Cu-P based amorphous filler during heating process
The changes that occur in the microstructure of crystalline and amorphous Cu-P-Sn-Ni filler metals during the heating process were studied by high-temperature microscopy, and the composition of solders at certain temperatures were analyzed by scanning electron microscopy and X-ray diffraction. The a...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
De Gruyter
2019-02-01
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| Series: | High Temperature Materials and Processes |
| Subjects: | |
| Online Access: | https://doi.org/10.1515/htmp-2019-0013 |