A numerical study on thermal bonding with preheating technique for polypropylene microfluidic device
This study presents a method for producing microfluidic chips from polypropylene using a pre-heated bonding area and thermal bonding technology. ANSYS was utilized to investigate the effects of bonding parameters and microchannel deformation and predict the bonding strength. Results show that carefu...
Main Authors: | , , , |
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Format: | Article |
Language: | English |
Published: |
De Gruyter
2023-10-01
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Series: | e-Polymers |
Subjects: | |
Online Access: | https://doi.org/10.1515/epoly-2023-0050 |