A numerical study on thermal bonding with preheating technique for polypropylene microfluidic device

A numerical study on thermal bonding with preheating technique for polypropylene microfluidic device

This study presents a method for producing microfluidic chips from polypropylene using a pre-heated bonding area and thermal bonding technology. ANSYS was utilized to investigate the effects of bonding parameters and microchannel deformation and predict the bonding strength. Results show that carefu...

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Bibliographic Details
Main Authors: Almezgagi Esam Abdulrahman, Fu Zhihong, Huang Gongjian, Zhang Xianyue
Format: Article
Language:English
Published: De Gruyter 2023-10-01
Series:e-Polymers
Subjects:
thermal bonding
microfluidic
numerical simulation
preheated bonding area
optimizing bonding parameters
Online Access:https://doi.org/10.1515/epoly-2023-0050

Internet

https://doi.org/10.1515/epoly-2023-0050

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