Robust Ag-Cu Sintering Bonding at 160 °C via Combining Ag<sub>2</sub>O Microparticle Paste and Pt-Catalyzed Formic Acid Vapor
With the assistance of Pt-catalyzed formic acid vapor, robust Ag-Cu bonding was realized at an ultra-low temperature of 160 °C under 3 MPa for 30 min via the sintering of Ag nanoparticles in situ generated from Ag<sub>2</sub>O microparticles. The Cu oxide layer at the interface...
| Main Authors: | , , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2020-02-01
|
| Series: | Metals |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2075-4701/10/3/315 |