Heat Transfer Performance and Structural Optimization of a Novel Micro-channel Heat Sink
Abstract With the advent of the 5G era, the design of electronic equipment is developing towards thinness, intelligence and multi-function, which requires higher cooling performance of the equipment. Micro-channel heat sink is promising for the heat dissipation of super-thin electronic equipment. In...
| Main Authors: | , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
SpringerOpen
2022-04-01
|
| Series: | Chinese Journal of Mechanical Engineering |
| Subjects: | |
| Online Access: | https://doi.org/10.1186/s10033-022-00704-5 |