Cracking mechanism analysis and experimental verification of encapsulated module under high low temperature cycle considering residual stress
Aiming at the cracking failure of the modified epoxy resin encapsulated module as a result of interface failure under high low temperature cycles, numerical simulation and experimental studies were carried out. Firstly, the residual stress field in the encapsulated module was reconstructed after mea...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | zho |
| Published: |
EDP Sciences
2023-06-01
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| Series: | Xibei Gongye Daxue Xuebao |
| Subjects: | |
| Online Access: | https://www.jnwpu.org/articles/jnwpu/full_html/2023/03/jnwpu2023413p447/jnwpu2023413p447.html |