Study of the effect of crystal orientation on the mechanical response and fatigue life of solder joints under thermal cycling by crystal plasticity
Electronic products are subjected to thermal cycling caused by power cycling in service processes. Owing to the difference in the coefficients of thermal expansion (CTEs) of solder joints and other packaging materials, solder joints suffer from thermomechanical fatigue, and cracks appear at their bo...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2023-11-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785423028880 |