A 240 × 160 3D-Stacked SPAD dToF Image Sensor With Rolling Shutter and In-Pixel Histogram for Mobile Devices
A 240 <inline-formula> <tex-math notation="LaTeX">$\times$ </tex-math></inline-formula> 160 single-photon avalanche diode (SPAD) sensor integrated with a 3D-stacked 65nm/65nm CMOS technology is reported for direct time-of-flight (dToF) 3D imaging in mobile devices....
Main Authors: | , , , , , , |
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Format: | Article |
Language: | English |
Published: |
IEEE
2022-01-01
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Series: | IEEE Open Journal of the Solid-State Circuits Society |
Subjects: | |
Online Access: | https://ieeexplore.ieee.org/document/9565145/ |