A 240 × 160 3D-Stacked SPAD dToF Image Sensor With Rolling Shutter and In-Pixel Histogram for Mobile Devices

A 240 <inline-formula> <tex-math notation="LaTeX">$\times$ </tex-math></inline-formula> 160 single-photon avalanche diode (SPAD) sensor integrated with a 3D-stacked 65nm/65nm CMOS technology is reported for direct time-of-flight (dToF) 3D imaging in mobile devices....

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Bibliographic Details
Main Authors: Chao Zhang, Ning Zhang, Zhijie Ma, Letian Wang, Yu Qin, Jieyang Jia, Kai Zang
Format: Article
Language:English
Published: IEEE 2022-01-01
Series:IEEE Open Journal of the Solid-State Circuits Society
Subjects:
Online Access:https://ieeexplore.ieee.org/document/9565145/