Numerical Study of Fluid Flow and Heat Transfer Characteristics in a Cone-Column Combined Heat Sink
Temperature has a great influence on the normal operation and service life of high-power electronic components. To cope with the increasingly severe heat problems in integrated circuits, an enhanced heat transfer factor <i>E</i> is introduced to evaluate the comprehensive heat transfer p...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2021-03-01
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| Series: | Energies |
| Subjects: | |
| Online Access: | https://www.mdpi.com/1996-1073/14/6/1605 |