Characterization of Residual Stress in SOI Wafers by Using MEMS Cantilever Beams

Characterization of Residual Stress in SOI Wafers by Using MEMS Cantilever Beams

Silicon-on-insulator (SOI) wafers are crucial raw materials in the manufacturing process of microelectromechanical systems (MEMS). Residual stresses generated inside the wafers during the fabrication process can seriously affect the performance, reliability, and yield of MEMS devices. In this paper,...

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Bibliographic Details
Main Authors: Haotian Yang, Min Liu, Yingmin Zhu, Weidong Wang, Xianming Qin, Lilong He, Kyle Jiang
Format: Article
Language:English
Published: MDPI AG 2023-07-01
Series:Micromachines
Subjects:
SOI
residual stress
cantilever beam
MEMS
characterization
Online Access:https://www.mdpi.com/2072-666X/14/8/1510

Internet

https://www.mdpi.com/2072-666X/14/8/1510

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