Experimental Study of Thermal and Pressure Performance of Porous Heat Sink Subjected to Al<sub>2</sub>O<sub>3</sub>-H<sub>2</sub>O Nanofluid
With the developing technology, the dimensions of electronic systems are becoming smaller, and their performance and the amount of energy they need increases. This situation causes the electronic components to heat up more and the existing cooling systems to become inadequate. In this study, instead...
Main Authors: | , , |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2022-08-01
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Series: | Electronics |
Subjects: | |
Online Access: | https://www.mdpi.com/2079-9292/11/15/2471 |