The Effect of Grain Orientation of β-Sn on Copper Pillar Solder Joints during Electromigration

The Effect of Grain Orientation of β-Sn on Copper Pillar Solder Joints during Electromigration

The grain orientation of Sn-based solder joints on copper pillars under the combined action of electron wind force and temperature gradient greatly affects their electromigration damage. The copper pillars with Sn-1.8Ag lead-free solder on the top was subjected to a current density of 1.5 × 10<su...

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Bibliographic Details
Main Authors: Kexin Xu, Xing Fu, Xinjie Wang, Zhiwei Fu, Xiaofeng Yang, Si Chen, Yijun Shi, Yun Huang, Hongtao Chen
Format: Article
Language:English
Published: MDPI AG 2021-12-01
Series:Materials
Subjects:
copper pillar
electromigration
grain orientation
IMC accumulation
preferred orientation
Online Access:https://www.mdpi.com/1996-1944/15/1/108

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https://www.mdpi.com/1996-1944/15/1/108

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