Interfacial Stabilities, Electronic Properties and Interfacial Fracture Mechanism of 6H-SiC Reinforced Copper Matrix Studied by the First Principles Method

Interfacial Stabilities, Electronic Properties and Interfacial Fracture Mechanism of 6H-SiC Reinforced Copper Matrix Studied by the First Principles Method

The interfacial mechanics and electrical properties of SiC reinforced copper matrix composites were studied via the first principles method. The work of adhesion (<i>W</i><sub>ad</sub>) and the interfacial energies were calculated to evaluate the stabilities of the SiC/Cu int...

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Bibliographic Details
Main Authors: Yao Shu, Shaowen Zhang, Yongnan Xiong, Xing Luo, Jiazhen He, Cuicui Yin, Xiaoyong Ding, Kaihong Zheng
Format: Article
Language:English
Published: MDPI AG 2021-12-01
Series:Crystals
Subjects:
6H-SiC
the first principles
copper matrix composites
electronic properties
Online Access:https://www.mdpi.com/2073-4352/12/1/51

Internet

https://www.mdpi.com/2073-4352/12/1/51

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