Interfacial Stabilities, Electronic Properties and Interfacial Fracture Mechanism of 6H-SiC Reinforced Copper Matrix Studied by the First Principles Method
The interfacial mechanics and electrical properties of SiC reinforced copper matrix composites were studied via the first principles method. The work of adhesion (<i>W</i><sub>ad</sub>) and the interfacial energies were calculated to evaluate the stabilities of the SiC/Cu int...
Main Authors: | Yao Shu, Shaowen Zhang, Yongnan Xiong, Xing Luo, Jiazhen He, Cuicui Yin, Xiaoyong Ding, Kaihong Zheng |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2021-12-01
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Series: | Crystals |
Subjects: | |
Online Access: | https://www.mdpi.com/2073-4352/12/1/51 |
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