Microstructural investigations and mechanical properties of pure lead-free (Sn–3.0Ag–0.5Cu and Sn–4.0Ag–0.5Cu) solder alloy
The Lead-free solders (SAC) with low Ag content have been identified as crucial solder to replace the traditional Sn–Pb solder. The main discussion was presented in two major area of microstructural investigation and mechanical properties of SAC305 and SAC405. Composition and microstructure of SAC s...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
The Netherlands Press
2018-04-01
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| Series: | Metallurgical & Materials Engineering |
| Subjects: | |
| Online Access: | http://metall-mater-eng.com/index.php/home/article/view/344 |