Microstructural investigations and mechanical properties of pure lead-free (Sn–3.0Ag–0.5Cu and Sn–4.0Ag–0.5Cu) solder alloy

Microstructural investigations and mechanical properties of pure lead-free (Sn–3.0Ag–0.5Cu and Sn–4.0Ag–0.5Cu) solder alloy

The Lead-free solders (SAC) with low Ag content have been identified as crucial solder to replace the traditional Sn–Pb solder. The main discussion was presented in two major area of microstructural investigation and mechanical properties of SAC305 and SAC405. Composition and microstructure of SAC s...

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Bibliographic Details
Main Authors: Manoj Kumar Pal, Gréta Gergely, Dániel Koncz Horváth, Zoltán Gácsi
Format: Article
Language:English
Published: The Netherlands Press 2018-04-01
Series:Metallurgical & Materials Engineering
Subjects:
Lead-free solder
Sn–Ag–Cu alloys
Microstructure
Mechanical properties.
Online Access:http://metall-mater-eng.com/index.php/home/article/view/344

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