Temperature Estimation of HBM2 Channels with Tail Distribution of Retention Errors in FPGA-HBM2 Platform
High-bandwidth memory 2 (HBM2) vertically stacks multiple dynamic random-access memory (DRAM) dies to achieve a small form factor and high capacity. However, it is difficult to diagnose HBM2 issues owing to their structural complexity and 2.5D integration with heterogeneous chips. The effects of the...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2022-12-01
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| Series: | Electronics |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2079-9292/12/1/32 |