Room temperature wafer bonding through conversion of polysilazane into $$\hbox {SiO}_{2}$$ SiO 2
Abstract Room temperature wafer bonding is a desirable approach for the packaging and assembly of diverse electronic devices. The formation of $$\hbox {SiO}_{2}$$ SiO 2 layer at the bonding interface is crucial for a reliable wafer bonding as represented by conventional bonding techniques such as hy...
| Main Authors: | , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Nature Portfolio
2024-01-01
|
| Series: | Scientific Reports |
| Online Access: | https://doi.org/10.1038/s41598-024-51800-6 |