Building of super high-efficiency processing technology based on innovative concept (Establishment of effective polishing process of SiC substrate using Dilatancy pad tool with bowl feed method)

Building of super high-efficiency processing technology based on innovative concept (Establishment of effective polishing process of SiC substrate using Dilatancy pad tool with bowl feed method)

In this study, we propose innovative polishing method for hard-to-process semiconductor substrate such as SiC. Our innovative polishing method mainly consists of 2 technologies. One is unprecedented polishing pad “Dilatancy pad” composed of special filler and viscoelastic material. The other is high...

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Bibliographic Details
Main Authors: Toshiro K. DOI, Kiyoshi SESHIMO, Tsutomu YAMAZAKI, Masanori OHTSUBO, Hideaki NISHIZAWA, Sachi MURAKAMI, Daizo ICHIKAWA, Yoshio NAKAMURA, Tadakazu MIYASHITA, Yoshihide KAWAMURA, Masataka TAKAGI, Hiroshi KASHIWADA, Hideo AIDA
Format: Article
Language:Japanese
Published: The Japan Society of Mechanical Engineers 2015-02-01
Series:Nihon Kikai Gakkai ronbunshu
Subjects:
polishing
hard-to-process material
sic
dilatancy effect
high speed/pressure processing
bowl feed method
surface roughness
removal rate
dameged layer
Online Access:https://www.jstage.jst.go.jp/article/transjsme/81/824/81_14-00618/_pdf/-char/en

Internet

https://www.jstage.jst.go.jp/article/transjsme/81/824/81_14-00618/_pdf/-char/en

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