Optical and geometric parameter extraction across 300-mm photonic integrated circuit wafers
The precise quantification of a dielectric waveguide core thickness, core width, core refractive index, and cladding refractive index across a wafer is critical for greater consistency and accuracy in photonic circuit fabrication. However, accurate wafer-scale measurements of these parameters have n...
| Main Authors: | , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
AIP Publishing LLC
2024-01-01
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| Series: | APL Photonics |
| Online Access: | http://dx.doi.org/10.1063/5.0173914 |