Fabrication of Al<sub>2</sub>O<sub>3</sub>/ZnO and Al<sub>2</sub>O<sub>3</sub>/Cu Reinforced Silicone Rubber Composite Pads for Thermal Interface Materials

Thermal interface materials (also known as thermal pads) are widely used as a crucial part to dissipate heat generated in miniaturized and integrated electronic components. Here, we systematically investigated the effects of small ceramic and metallic powders in rubbery thermal composite pads with a...

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Bibliographic Details
Main Authors: Seokkyu Jang, Eun Ji Choi, Han Jin Cheon, Won Il Choi, Woon Seo Shin, Jong-Min Lim
Format: Article
Language:English
Published: MDPI AG 2021-09-01
Series:Polymers
Subjects:
Online Access:https://www.mdpi.com/2073-4360/13/19/3259