Thermal Performance Analysis of Various Heat Sinks Based on Alumina NePCM for Passive Cooling of Electronic Components: An Experimental Study

Thermal Performance Analysis of Various Heat Sinks Based on Alumina NePCM for Passive Cooling of Electronic Components: An Experimental Study

In the modern digital world, electronic devices are being widely employed for various applications where thermal performance represents a significant technical challenge due to continued miniaturization, high heat generated in the system, and non-uniform high-temperature causing failure. Phase chang...

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Bibliographic Details
Main Authors: Imran Zahid, Muhammad Farooq, Muhammad Farhan, Muhammad Usman, Adnan Qamar, Muhammad Imran, Mejdal A. Alqahtani, Saqib Anwar, Muhammad Sultan, Muhammad Yasar Javaid
Format: Article
Language:English
Published: MDPI AG 2022-11-01
Series:Energies
Subjects:
nano-enhanced phase change material
simple heat sink
square pin-fin heat sink
copper foam
heat flux
thermal management
Online Access:https://www.mdpi.com/1996-1073/15/22/8416

Internet

https://www.mdpi.com/1996-1073/15/22/8416

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