Electromagnetic compatibility technologies based on multi-functional spoof surface plasmon polariton channels

Electromagnetic compatibility technologies based on multi-functional spoof surface plasmon polariton channels

High integration of modern microwave circuits and systems puts forward higher requirements for multi-function and electromagnetic compatibility (EMC) performance of transmission channels. In this paper, we propose two EMC technologies including the substrate integrated packaging (SIP) and tuneable w...

Full description

Bibliographic Details
Main Authors: Ling Yun Niu, Hao Chi Zhang, Pei Hang He, Yi Fan, Le Peng Zhang, Tie Jun Cui
Format: Article
Language:English
Published: IOP Publishing 2023-01-01
Series:JPhys Photonics
Subjects:
spoof surface plasmon polaritons (SSPPs)
electromagnetic compatibility (EMC)
multi-function
substrate integrated packaging technology
tuneable wavenumber mismatching technology
Online Access:https://doi.org/10.1088/2515-7647/acacda

Internet

https://doi.org/10.1088/2515-7647/acacda

Similar Items