Electromagnetic compatibility technologies based on multi-functional spoof surface plasmon polariton channels
High integration of modern microwave circuits and systems puts forward higher requirements for multi-function and electromagnetic compatibility (EMC) performance of transmission channels. In this paper, we propose two EMC technologies including the substrate integrated packaging (SIP) and tuneable w...
Main Authors: | Ling Yun Niu, Hao Chi Zhang, Pei Hang He, Yi Fan, Le Peng Zhang, Tie Jun Cui |
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Format: | Article |
Language: | English |
Published: |
IOP Publishing
2023-01-01
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Series: | JPhys Photonics |
Subjects: | |
Online Access: | https://doi.org/10.1088/2515-7647/acacda |
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