Noncuring Graphene Thermal Interface Materials for Advanced Electronics

Noncuring Graphene Thermal Interface Materials for Advanced Electronics

Abstract Development of next‐generation thermal interface materials (TIMs) with high thermal conductivity is important for thermal management and packaging of electronic devices. The synthesis and thermal conductivity measurements of noncuring thermal paste, i.e., grease, based on mineral oil with a...

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Bibliographic Details
Main Authors: Sahar Naghibi, Fariborz Kargar, Dylan Wright, Chun Yu Tammy Huang, Amirmahdi Mohammadzadeh, Zahra Barani, Ruben Salgado, Alexander A. Balandin
Format: Article
Language:English
Published: Wiley-VCH 2020-04-01
Series:Advanced Electronic Materials
Subjects:
graphene
percolation threshold
thermal conductivity
thermal‐interface materials
thermal paste
Online Access:https://doi.org/10.1002/aelm.201901303

Internet

https://doi.org/10.1002/aelm.201901303

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