Feasibility Study of an Automated Assembly Process for Ultrathin Chips

Feasibility Study of an Automated Assembly Process for Ultrathin Chips

This paper presents a feasibility study of an automated pick-and-place process for ultrathin chips on a standard automatic assembly machine. So far, scientific research about automated assembly of ultrathin chips, with thicknesses less than 50 µm, is missing, but is necessary for cost-effective, hig...

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Bibliographic Details
Main Authors: Florian Janek, Ebru Saller, Ernst Müller, Thomas Meißner, Sascha Weser, Maximilian Barth, Wolfgang Eberhardt, André Zimmermann
Format: Article
Language:English
Published: MDPI AG 2020-06-01
Series:Micromachines
Subjects:
system-in-foil
ultrathin chips
automated assembly
Online Access:https://www.mdpi.com/2072-666X/11/7/654

Internet

https://www.mdpi.com/2072-666X/11/7/654

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