Feasibility Study of an Automated Assembly Process for Ultrathin Chips
This paper presents a feasibility study of an automated pick-and-place process for ultrathin chips on a standard automatic assembly machine. So far, scientific research about automated assembly of ultrathin chips, with thicknesses less than 50 µm, is missing, but is necessary for cost-effective, hig...
| Main Authors: | , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2020-06-01
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| Series: | Micromachines |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2072-666X/11/7/654 |
| _version_ | 1797563697719148544 |
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| author | Florian Janek Ebru Saller Ernst Müller Thomas Meißner Sascha Weser Maximilian Barth Wolfgang Eberhardt André Zimmermann |
| author_facet | Florian Janek Ebru Saller Ernst Müller Thomas Meißner Sascha Weser Maximilian Barth Wolfgang Eberhardt André Zimmermann |
| author_sort | Florian Janek |
| collection | DOAJ |
| description | This paper presents a feasibility study of an automated pick-and-place process for ultrathin chips on a standard automatic assembly machine. So far, scientific research about automated assembly of ultrathin chips, with thicknesses less than 50 µm, is missing, but is necessary for cost-effective, high-quantity production of system-in-foil for applications in narrow spaces or flexible smart health systems applied in biomedical applications. Novel pick-and-place tools for ultrathin chip handling were fabricated and a process for chip detachment from thermal release foil was developed. On this basis, an adhesive bonding process for ultrathin chips with 30 µm thickness was developed and transferred to an automatic assembly machine. Multiple ultrathin chips aligned to each other were automatically placed and transferred onto glass and polyimide foil with a relative placement accuracy of ±25 µm. |
| first_indexed | 2024-03-10T18:47:08Z |
| format | Article |
| id | doaj.art-1c3ef1b953944d1cb9f33431ea4ef555 |
| institution | Directory Open Access Journal |
| issn | 2072-666X |
| language | English |
| last_indexed | 2024-03-10T18:47:08Z |
| publishDate | 2020-06-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Micromachines |
| spelling | doaj.art-1c3ef1b953944d1cb9f33431ea4ef5552023-11-20T05:26:10ZengMDPI AGMicromachines2072-666X2020-06-0111765410.3390/mi11070654Feasibility Study of an Automated Assembly Process for Ultrathin ChipsFlorian Janek0Ebru Saller1Ernst Müller2Thomas Meißner3Sascha Weser4Maximilian Barth5Wolfgang Eberhardt6André Zimmermann7Hahn-Schickard, Allmandring 9b, 70569 Stuttgart, GermanyHahn-Schickard, Allmandring 9b, 70569 Stuttgart, GermanyInstitute for Micro Integration (IFM), University of Stuttgart, Allmandring 9B, 70569 Stuttgart, GermanyHahn-Schickard, Allmandring 9b, 70569 Stuttgart, GermanyHahn-Schickard, Allmandring 9b, 70569 Stuttgart, GermanyHahn-Schickard, Allmandring 9b, 70569 Stuttgart, GermanyHahn-Schickard, Allmandring 9b, 70569 Stuttgart, GermanyHahn-Schickard, Allmandring 9b, 70569 Stuttgart, GermanyThis paper presents a feasibility study of an automated pick-and-place process for ultrathin chips on a standard automatic assembly machine. So far, scientific research about automated assembly of ultrathin chips, with thicknesses less than 50 µm, is missing, but is necessary for cost-effective, high-quantity production of system-in-foil for applications in narrow spaces or flexible smart health systems applied in biomedical applications. Novel pick-and-place tools for ultrathin chip handling were fabricated and a process for chip detachment from thermal release foil was developed. On this basis, an adhesive bonding process for ultrathin chips with 30 µm thickness was developed and transferred to an automatic assembly machine. Multiple ultrathin chips aligned to each other were automatically placed and transferred onto glass and polyimide foil with a relative placement accuracy of ±25 µm.https://www.mdpi.com/2072-666X/11/7/654system-in-foilultrathin chipsautomated assembly |
| spellingShingle | Florian Janek Ebru Saller Ernst Müller Thomas Meißner Sascha Weser Maximilian Barth Wolfgang Eberhardt André Zimmermann Feasibility Study of an Automated Assembly Process for Ultrathin Chips Micromachines system-in-foil ultrathin chips automated assembly |
| title | Feasibility Study of an Automated Assembly Process for Ultrathin Chips |
| title_full | Feasibility Study of an Automated Assembly Process for Ultrathin Chips |
| title_fullStr | Feasibility Study of an Automated Assembly Process for Ultrathin Chips |
| title_full_unstemmed | Feasibility Study of an Automated Assembly Process for Ultrathin Chips |
| title_short | Feasibility Study of an Automated Assembly Process for Ultrathin Chips |
| title_sort | feasibility study of an automated assembly process for ultrathin chips |
| topic | system-in-foil ultrathin chips automated assembly |
| url | https://www.mdpi.com/2072-666X/11/7/654 |
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