Co-Package Technology Platform for Low-Power and Low-Cost Data Centers

Co-Package Technology Platform for Low-Power and Low-Cost Data Centers

We report recent advances in photonic–electronic integration developed in the European research project L3MATRIX. The aim of the project was to demonstrate the basic building blocks of a co-packaged optical system. Two-dimensional silicon photonics arrays with 64 modulators were fabricated. Novel mo...

Full description

Bibliographic Details
Main Authors: Konstantinos Papatryfonos, David R. Selviah, Avi Maman, Kobi Hasharoni, Antoine Brimont, Andrea Zanzi, Jochen Kraft, Victor Sidorov, Marc Seifried, Yannick Baumgartner, Folkert Horst, Bert Jan Offrein, Katarzyna Lawniczuk, Ronald G. Broeke, Nikos Terzenidis, George Mourgias-Alexandris, Mingchu Tang, Alwyn J. Seeds, Huiyun Liu, Pablo Sanchis, Miltiadis Moralis-Pegios, Thanasis Manolis, Nikos Pleros, Konstantinos Vyrsokinos, Bogdan Sirbu, Yann Eichhammer, Hermann Oppermann, Tolga Tekin
Format: Article
Language:English
Published: MDPI AG 2021-06-01
Series:Applied Sciences
Subjects:
silicon photonics
3D device integration
hybrid integration
optical interconnects
quantum well hybrid laser
quantum dots
Online Access:https://www.mdpi.com/2076-3417/11/13/6098

Internet

https://www.mdpi.com/2076-3417/11/13/6098

Similar Items