Contact angle analysis and intermetallic compounds formation between solders and substrates under formic acid atmosphere
In 3D packaging, an increase in the solder bump density and reductions in solder-bump height are the roadblocks to using gel or liquid fluxes for the soldering process. Fluxless soldering has become a popular technology, and the formic acid (FA) atmosphere soldering is one of the most promising flux...
| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2022-11-01
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| Series: | Journal of Advanced Joining Processes |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2666330922000243 |