Contact angle analysis and intermetallic compounds formation between solders and substrates under formic acid atmosphere
In 3D packaging, an increase in the solder bump density and reductions in solder-bump height are the roadblocks to using gel or liquid fluxes for the soldering process. Fluxless soldering has become a popular technology, and the formic acid (FA) atmosphere soldering is one of the most promising flux...
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| Format: | Article |
| Language: | English |
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Elsevier
2022-11-01
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| Series: | Journal of Advanced Joining Processes |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2666330922000243 |
| _version_ | 1811187630054834176 |
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| author | Siliang He Yuhao Bi Yu-An Shen Zhikuan Chen Gao Yue Chuan Hu Hiroshi Nishikawa |
| author_facet | Siliang He Yuhao Bi Yu-An Shen Zhikuan Chen Gao Yue Chuan Hu Hiroshi Nishikawa |
| author_sort | Siliang He |
| collection | DOAJ |
| description | In 3D packaging, an increase in the solder bump density and reductions in solder-bump height are the roadblocks to using gel or liquid fluxes for the soldering process. Fluxless soldering has become a popular technology, and the formic acid (FA) atmosphere soldering is one of the most promising fluxless soldering techniques. In this study, the effects of FA atmosphere on contact angle and the intermetallic compounds formation between three different solders (Sn-58Bi, Sn-3.0Ag-0.5Cu, and Sn-0.5Sb) and two different substrates (Cu and Ni/Cu) were investigated. The results indicate that the wettability of those soldering systems of FA soldering is very similar to that of soldering with the solder flux. Moreover, the effect of pre-heat treatment on the wettability of the Sn-3.0Ag-0.5Cu solder (SAC)/Cu by FA soldering was investigated. With the increase in the pre-heat time, the soldering wettability was improved. And there was no significant difference in the interfacial reactions of SAC/Cu between FA and flux soldering according to the microstructural study results before and thermal aging. This paper verifies that the FA atmosphere is suitable for various lead-free solders and substrates to achieve fluxless soldering and then provides a theoretical reference for the industrialization of formic acid atmosphere in electronic packaging. |
| first_indexed | 2024-04-11T14:05:33Z |
| format | Article |
| id | doaj.art-1c5f3da602874a2191c3d46e4a6c268e |
| institution | Directory Open Access Journal |
| issn | 2666-3309 |
| language | English |
| last_indexed | 2024-04-11T14:05:33Z |
| publishDate | 2022-11-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Journal of Advanced Joining Processes |
| spelling | doaj.art-1c5f3da602874a2191c3d46e4a6c268e2022-12-22T04:19:53ZengElsevierJournal of Advanced Joining Processes2666-33092022-11-016100118Contact angle analysis and intermetallic compounds formation between solders and substrates under formic acid atmosphereSiliang He0Yuhao Bi1Yu-An Shen2Zhikuan Chen3Gao Yue4Chuan Hu5Hiroshi Nishikawa6Institute of Semiconductors, Guangdong Academy of Sciences, Guangzhou, Guangdong 510650, China; Guangxi Key Laboratory of Manufacturing System & Advanced Manufacturing Technology, School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, Guangxi 541004, China; Joining and Welding Research Institute, Osaka University, Osaka Ibaraki 565-0047, Japan; Corresponding authors at: Institute of Semiconductors, Guangdong Academy of Sciences, Guangzhou, Guangdong 510650, China.Institute of Semiconductors, Guangdong Academy of Sciences, Guangzhou, Guangdong 510650, China; Guangxi Key Laboratory of Manufacturing System & Advanced Manufacturing Technology, School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, Guangxi 541004, ChinaDepartment of Materials Science and Engineering, Feng Chia University, Taichung 407, TaiwanInstitute of Semiconductors, Guangdong Academy of Sciences, Guangzhou, Guangdong 510650, ChinaGuangxi Key Laboratory of Manufacturing System & Advanced Manufacturing Technology, School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, Guangxi 541004, China; Corresponding authors at: Institute of Semiconductors, Guangdong Academy of Sciences, Guangzhou, Guangdong 510650, China.Institute of Semiconductors, Guangdong Academy of Sciences, Guangzhou, Guangdong 510650, ChinaJoining and Welding Research Institute, Osaka University, Osaka Ibaraki 565-0047, JapanIn 3D packaging, an increase in the solder bump density and reductions in solder-bump height are the roadblocks to using gel or liquid fluxes for the soldering process. Fluxless soldering has become a popular technology, and the formic acid (FA) atmosphere soldering is one of the most promising fluxless soldering techniques. In this study, the effects of FA atmosphere on contact angle and the intermetallic compounds formation between three different solders (Sn-58Bi, Sn-3.0Ag-0.5Cu, and Sn-0.5Sb) and two different substrates (Cu and Ni/Cu) were investigated. The results indicate that the wettability of those soldering systems of FA soldering is very similar to that of soldering with the solder flux. Moreover, the effect of pre-heat treatment on the wettability of the Sn-3.0Ag-0.5Cu solder (SAC)/Cu by FA soldering was investigated. With the increase in the pre-heat time, the soldering wettability was improved. And there was no significant difference in the interfacial reactions of SAC/Cu between FA and flux soldering according to the microstructural study results before and thermal aging. This paper verifies that the FA atmosphere is suitable for various lead-free solders and substrates to achieve fluxless soldering and then provides a theoretical reference for the industrialization of formic acid atmosphere in electronic packaging.http://www.sciencedirect.com/science/article/pii/S2666330922000243SolderingWettabilityInterfacial reactionFluxlessFormic acid |
| spellingShingle | Siliang He Yuhao Bi Yu-An Shen Zhikuan Chen Gao Yue Chuan Hu Hiroshi Nishikawa Contact angle analysis and intermetallic compounds formation between solders and substrates under formic acid atmosphere Journal of Advanced Joining Processes Soldering Wettability Interfacial reaction Fluxless Formic acid |
| title | Contact angle analysis and intermetallic compounds formation between solders and substrates under formic acid atmosphere |
| title_full | Contact angle analysis and intermetallic compounds formation between solders and substrates under formic acid atmosphere |
| title_fullStr | Contact angle analysis and intermetallic compounds formation between solders and substrates under formic acid atmosphere |
| title_full_unstemmed | Contact angle analysis and intermetallic compounds formation between solders and substrates under formic acid atmosphere |
| title_short | Contact angle analysis and intermetallic compounds formation between solders and substrates under formic acid atmosphere |
| title_sort | contact angle analysis and intermetallic compounds formation between solders and substrates under formic acid atmosphere |
| topic | Soldering Wettability Interfacial reaction Fluxless Formic acid |
| url | http://www.sciencedirect.com/science/article/pii/S2666330922000243 |
| work_keys_str_mv | AT silianghe contactangleanalysisandintermetalliccompoundsformationbetweensoldersandsubstratesunderformicacidatmosphere AT yuhaobi contactangleanalysisandintermetalliccompoundsformationbetweensoldersandsubstratesunderformicacidatmosphere AT yuanshen contactangleanalysisandintermetalliccompoundsformationbetweensoldersandsubstratesunderformicacidatmosphere AT zhikuanchen contactangleanalysisandintermetalliccompoundsformationbetweensoldersandsubstratesunderformicacidatmosphere AT gaoyue contactangleanalysisandintermetalliccompoundsformationbetweensoldersandsubstratesunderformicacidatmosphere AT chuanhu contactangleanalysisandintermetalliccompoundsformationbetweensoldersandsubstratesunderformicacidatmosphere AT hiroshinishikawa contactangleanalysisandintermetalliccompoundsformationbetweensoldersandsubstratesunderformicacidatmosphere |