A Low-Power CMOS Image Sensor With Multiple-Column-Parallel Readout Structure

This paper presents a low-power multiple-column-parallel (MCP) readout CMOS image sensor (CIS) in terms of its structural features. Because each column in an MCP unit performs analog-to-digital (A/D) conversion sequentially, the columns have their own operating periods before and after A/D conversio...

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Bibliographic Details
Main Authors: Jang-Su Hyeon, Sang-Hyeon Kim, Hyeon-June Kim
Format: Article
Language:English
Published: IEEE 2022-01-01
Series:IEEE Journal of the Electron Devices Society
Subjects:
Online Access:https://ieeexplore.ieee.org/document/9698408/