A Low-Power CMOS Image Sensor With Multiple-Column-Parallel Readout Structure
This paper presents a low-power multiple-column-parallel (MCP) readout CMOS image sensor (CIS) in terms of its structural features. Because each column in an MCP unit performs analog-to-digital (A/D) conversion sequentially, the columns have their own operating periods before and after A/D conversio...
Main Authors: | , , |
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Format: | Article |
Language: | English |
Published: |
IEEE
2022-01-01
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Series: | IEEE Journal of the Electron Devices Society |
Subjects: | |
Online Access: | https://ieeexplore.ieee.org/document/9698408/ |