Microstructure and properties of Sn58Bi/Ni solder joint modified by Mg particles

In this paper, various mass fractions (0, 0.1, 0.2, 0.4, 0.6, 0.8 wt%) of Mg particles were added to the Sn58Bi solder to achieve the purpose of modification, through which the Ni substrate was connected successfully through bonding at 250 °C for 2 min. Meanwhile, the microstructure, interfacial IMC...

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Bibliographic Details
Main Authors: Chen Chen, Liang Zhang, Xi Wang, Xiao Lu, Yong-huan Guo
Format: Article
Language:English
Published: Elsevier 2023-05-01
Series:Journal of Materials Research and Technology
Subjects:
Online Access:http://www.sciencedirect.com/science/article/pii/S2238785423004726