Microstructure and properties of Sn58Bi/Ni solder joint modified by Mg particles
In this paper, various mass fractions (0, 0.1, 0.2, 0.4, 0.6, 0.8 wt%) of Mg particles were added to the Sn58Bi solder to achieve the purpose of modification, through which the Ni substrate was connected successfully through bonding at 250 °C for 2 min. Meanwhile, the microstructure, interfacial IMC...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2023-05-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785423004726 |