Development of a Low-Expansion and Low-Shrinkage Thermoset Injection Moulding Compound Tailored to Laminated Electrical Sheets
This study presents a thermoset moulding compound designed for electrical machines with high power densities. The compound reduces residual stresses induced by the difference in thermal expansion during use and by shrinkage in the compound during the manufacturing process. To reduce the internal str...
Main Authors: | , , , , , , |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2024-07-01
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Series: | World Electric Vehicle Journal |
Subjects: | |
Online Access: | https://www.mdpi.com/2032-6653/15/7/319 |