Development of a Low-Expansion and Low-Shrinkage Thermoset Injection Moulding Compound Tailored to Laminated Electrical Sheets

This study presents a thermoset moulding compound designed for electrical machines with high power densities. The compound reduces residual stresses induced by the difference in thermal expansion during use and by shrinkage in the compound during the manufacturing process. To reduce the internal str...

Full description

Bibliographic Details
Main Authors: Florian Braunbeck, Florian Schönl, Timo Preußler, Hans-Christian Reuss, Martin Demleitner, Holger Ruckdäschel, Philipp Berendes
Format: Article
Language:English
Published: MDPI AG 2024-07-01
Series:World Electric Vehicle Journal
Subjects:
Online Access:https://www.mdpi.com/2032-6653/15/7/319