Wafer‐Level Manufacturing of MEMS H2 Sensing Chips Based on Pd Nanoparticles Modified SnO2 Film Patterns
Abstract In this manuscript, a simple method combining atomic layer deposition and magnetron sputtering is developed to fabricate high‐performance Pd/SnO2 film patterns applied for micro‐electro‐mechanical systems (MEMS) H2 sensing chips. SnO2 film is first accurately deposited in the central areas...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Wiley
2023-09-01
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| Series: | Advanced Science |
| Subjects: | |
| Online Access: | https://doi.org/10.1002/advs.202302614 |
| _version_ | 1797684928484212736 |
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| author | Zheng Zhang Liyang Luo Yanlin Zhang Guoliang Lv Yuanyuan Luo Guotao Duan |
| author_facet | Zheng Zhang Liyang Luo Yanlin Zhang Guoliang Lv Yuanyuan Luo Guotao Duan |
| author_sort | Zheng Zhang |
| collection | DOAJ |
| description | Abstract In this manuscript, a simple method combining atomic layer deposition and magnetron sputtering is developed to fabricate high‐performance Pd/SnO2 film patterns applied for micro‐electro‐mechanical systems (MEMS) H2 sensing chips. SnO2 film is first accurately deposited in the central areas of MEMS micro hotplate arrays by a mask‐assistant method, leading the patterns with wafer‐level high consistency in thickness. The grain size and density of Pd nanoparticles modified on the surface of the SnO2 film are further regulated to obtain an optimized sensing performance. The resulting MEMS H2 sensing chips show a wide detection range from 0.5 to 500 ppm, high resolution, and good repeatability. Based on the experiments and density functional theory calculations, a sensing enhancement mechanism is also proposed: a certain amount of Pd nanoparticles modified on the SnO2 surface could bring stronger H2 adsorption followed by dissociation, diffusion, and reaction with surface adsorbed oxygen species. Obviously, the method provided here is quite simple and effective for the manufacturing of MEMS H2 sensing chips with high consistency and optimized performance, which may also find broad applications in other MEMS chip technologies. |
| first_indexed | 2024-03-12T00:36:54Z |
| format | Article |
| id | doaj.art-1d94dbfeb9ba456cae61868f69aac97c |
| institution | Directory Open Access Journal |
| issn | 2198-3844 |
| language | English |
| last_indexed | 2024-03-12T00:36:54Z |
| publishDate | 2023-09-01 |
| publisher | Wiley |
| record_format | Article |
| series | Advanced Science |
| spelling | doaj.art-1d94dbfeb9ba456cae61868f69aac97c2023-09-15T09:28:59ZengWileyAdvanced Science2198-38442023-09-011026n/an/a10.1002/advs.202302614Wafer‐Level Manufacturing of MEMS H2 Sensing Chips Based on Pd Nanoparticles Modified SnO2 Film PatternsZheng Zhang0Liyang Luo1Yanlin Zhang2Guoliang Lv3Yuanyuan Luo4Guotao Duan5School of Integrated Circuits Huazhong University of Science and Technology Wuhan 430074 ChinaSchool of Integrated Circuits Huazhong University of Science and Technology Wuhan 430074 ChinaSchool of Integrated Circuits Huazhong University of Science and Technology Wuhan 430074 ChinaSchool of Integrated Circuits Huazhong University of Science and Technology Wuhan 430074 ChinaKey Laboratory of Materials Physics Institute of Solid State Physics HFIPS Chinese Academy of Sciences Hefei 230031 ChinaSchool of Integrated Circuits Huazhong University of Science and Technology Wuhan 430074 ChinaAbstract In this manuscript, a simple method combining atomic layer deposition and magnetron sputtering is developed to fabricate high‐performance Pd/SnO2 film patterns applied for micro‐electro‐mechanical systems (MEMS) H2 sensing chips. SnO2 film is first accurately deposited in the central areas of MEMS micro hotplate arrays by a mask‐assistant method, leading the patterns with wafer‐level high consistency in thickness. The grain size and density of Pd nanoparticles modified on the surface of the SnO2 film are further regulated to obtain an optimized sensing performance. The resulting MEMS H2 sensing chips show a wide detection range from 0.5 to 500 ppm, high resolution, and good repeatability. Based on the experiments and density functional theory calculations, a sensing enhancement mechanism is also proposed: a certain amount of Pd nanoparticles modified on the SnO2 surface could bring stronger H2 adsorption followed by dissociation, diffusion, and reaction with surface adsorbed oxygen species. Obviously, the method provided here is quite simple and effective for the manufacturing of MEMS H2 sensing chips with high consistency and optimized performance, which may also find broad applications in other MEMS chip technologies.https://doi.org/10.1002/advs.202302614film patternsH2 sensing chipshigh‐consistencymicro‐electro‐mechanical systemswafer‐level |
| spellingShingle | Zheng Zhang Liyang Luo Yanlin Zhang Guoliang Lv Yuanyuan Luo Guotao Duan Wafer‐Level Manufacturing of MEMS H2 Sensing Chips Based on Pd Nanoparticles Modified SnO2 Film Patterns Advanced Science film patterns H2 sensing chips high‐consistency micro‐electro‐mechanical systems wafer‐level |
| title | Wafer‐Level Manufacturing of MEMS H2 Sensing Chips Based on Pd Nanoparticles Modified SnO2 Film Patterns |
| title_full | Wafer‐Level Manufacturing of MEMS H2 Sensing Chips Based on Pd Nanoparticles Modified SnO2 Film Patterns |
| title_fullStr | Wafer‐Level Manufacturing of MEMS H2 Sensing Chips Based on Pd Nanoparticles Modified SnO2 Film Patterns |
| title_full_unstemmed | Wafer‐Level Manufacturing of MEMS H2 Sensing Chips Based on Pd Nanoparticles Modified SnO2 Film Patterns |
| title_short | Wafer‐Level Manufacturing of MEMS H2 Sensing Chips Based on Pd Nanoparticles Modified SnO2 Film Patterns |
| title_sort | wafer level manufacturing of mems h2 sensing chips based on pd nanoparticles modified sno2 film patterns |
| topic | film patterns H2 sensing chips high‐consistency micro‐electro‐mechanical systems wafer‐level |
| url | https://doi.org/10.1002/advs.202302614 |
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