Growth Rates of HFCVD Diamond Films on Silicon Carbide Substrates for Heat Dissipation Applications

Diamond has an extremely high thermal conductivity, making it to have a great potential as a heat dissipation material. Based on the hot filament chemical vapor deposition (HFCVD) technique, diamond thick films were deposited on silicon carbide substrates by using the multi-step method in this paper...

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Bibliographic Details
Main Author: LI Weihan, QIAO Yu, SHU Da, WANG Xinchang
Format: Article
Language:zho
Published: Editorial Office of Journal of Shanghai Jiao Tong University 2023-08-01
Series:Shanghai Jiaotong Daxue xuebao
Subjects:
Online Access:https://xuebao.sjtu.edu.cn/article/2023/1006-2467/1006-2467-57-8-1078.shtml