Modelling of the microstructure and thermal conductivity of SiC-bonded diamond materials
Materials with high thermal conductivity are required in a wide range of thermal management applications. Silicon carbide (SiC) bonded diamond materials, which can be produced without pressure, are a possible candidate for such applications. They exhibit thermal conductivities >650 W/(m·K) depend...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2024-06-01
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| Series: | Open Ceramics |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2666539524000580 |