High Density Multi-Channel Passively Aligned Optical Probe for Testing of Photonic Integrated Circuits
In this work we report the results of high density multi-channel optical multiprobes with pitches of 25 μm and 50 μm that provide edge-coupling used for on-wafer parallel testing of photonic integrated circuits. The probes are fabricated in an oxynitride platform and test demon...
Main Authors: | , , |
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Format: | Article |
Language: | English |
Published: |
IEEE
2021-01-01
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Series: | IEEE Photonics Journal |
Subjects: | |
Online Access: | https://ieeexplore.ieee.org/document/9296295/ |