Survey on Fatigue Life Prediction of BGA Solder Joints
With the development of science and technology, consumers’ requirements for various electronic devices present a trend of more diverse functions and thinner bodies. This makes integrated circuits mounted in electronic products and their packaging more vital to satisfying the above requirements. Ball...
| Main Authors: | , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2022-02-01
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| Series: | Electronics |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2079-9292/11/4/542 |