Survey on Fatigue Life Prediction of BGA Solder Joints

Survey on Fatigue Life Prediction of BGA Solder Joints

With the development of science and technology, consumers’ requirements for various electronic devices present a trend of more diverse functions and thinner bodies. This makes integrated circuits mounted in electronic products and their packaging more vital to satisfying the above requirements. Ball...

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Bibliographic Details
Main Authors: Baojun Qiu, Jingang Xiong, Han Wang, Shuai Zhou, Xiuding Yang, Zhengpei Lin, Maolin Liu, Nian Cai
Format: Article
Language:English
Published: MDPI AG 2022-02-01
Series:Electronics
Subjects:
BGA packaging
solder joints
fatigue life prediction
fatigue failure
survey
Online Access:https://www.mdpi.com/2079-9292/11/4/542

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