Durability Assessment of Bonded Piezoelectric Wafer Active Sensors for Aircraft Health Monitoring Applications
This study conducted experimental and numerical investigations on piezoelectric wafer active sensors (PWASs) bonded to an aluminum plate to assess the impact of bonding degradation on Lamb wave generation. Three surface-bonded PWASs were examined, including one intentionally bonded with a reduced ad...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2024-01-01
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| Series: | Sensors |
| Subjects: | |
| Online Access: | https://www.mdpi.com/1424-8220/24/2/450 |