Characterizing the Thermal Feasibility of Monolithic 3D Microprocessors
Monolithic 3D (M3D) integration reduces the wire length, which eventually improves energy efficiency and performance compared to 2D integration. However, 3D integration inevitably causes higher on-chip temperature compared to 2D integration due to the increased power density as well as worse heat di...
| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2021-01-01
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| Series: | IEEE Access |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/9524684/ |