Characterizing the Thermal Feasibility of Monolithic 3D Microprocessors
Monolithic 3D (M3D) integration reduces the wire length, which eventually improves energy efficiency and performance compared to 2D integration. However, 3D integration inevitably causes higher on-chip temperature compared to 2D integration due to the increased power density as well as worse heat di...
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| Format: | Article |
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IEEE
2021-01-01
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| Series: | IEEE Access |
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| Online Access: | https://ieeexplore.ieee.org/document/9524684/ |
| _version_ | 1818586373666373632 |
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| author | Ji Heon Lee Young Seo Lee Jeong Hwan Choi Hussam Amrouch Joonho Kong Young-Ho Gong Sung Woo Chung |
| author_facet | Ji Heon Lee Young Seo Lee Jeong Hwan Choi Hussam Amrouch Joonho Kong Young-Ho Gong Sung Woo Chung |
| author_sort | Ji Heon Lee |
| collection | DOAJ |
| description | Monolithic 3D (M3D) integration reduces the wire length, which eventually improves energy efficiency and performance compared to 2D integration. However, 3D integration inevitably causes higher on-chip temperature compared to 2D integration due to the increased power density as well as worse heat dissipation. The high on-chip temperature may offset the benefits of the M3D microprocessors due to the following reasons: 1) high on-chip temperature increases leakage power, which degrades energy efficiency. 2) the actual clock frequency is limited at run-time by frequent dynamic thermal management (DTM) invocations. In this paper, for the first time, we explore the <italic>thermal feasibility</italic> (whether it is possible to achieve high energy efficiency and performance without exceeding threshold temperature) of the M3D microprocessors depending on cooling solutions. For the thermal feasibility study, we construct an integrated framework to investigate the thermal behaviors and thermal feasibility of different types of microprocessors (M3D, 2D, and through-silicon-via based 3D (TSV-3D)) with different cooling solutions. Our thermal-aware evaluation results show that the best configuration of the M3D microprocessors reduces average energy consumption by 27.6% compared to the 2D microprocessor at an iso-frequency (4.0GHz). In addition, at the highest clock frequencies satisfying both design and thermal constraints, the best configuration of the M3D microprocessors improves average system performance by 25.1% and 26.0% compared to the 2D and TSV-3D microprocessors, respectively. |
| first_indexed | 2024-12-16T08:51:56Z |
| format | Article |
| id | doaj.art-20989edb02404bf5b3bc606e07969682 |
| institution | Directory Open Access Journal |
| issn | 2169-3536 |
| language | English |
| last_indexed | 2024-12-16T08:51:56Z |
| publishDate | 2021-01-01 |
| publisher | IEEE |
| record_format | Article |
| series | IEEE Access |
| spelling | doaj.art-20989edb02404bf5b3bc606e079696822022-12-21T22:37:23ZengIEEEIEEE Access2169-35362021-01-01912071512072910.1109/ACCESS.2021.31086289524684Characterizing the Thermal Feasibility of Monolithic 3D MicroprocessorsJi Heon Lee0Young Seo Lee1https://orcid.org/0000-0001-9137-8217Jeong Hwan Choi2https://orcid.org/0000-0002-6918-0236Hussam Amrouch3https://orcid.org/0000-0002-5649-3102Joonho Kong4https://orcid.org/0000-0002-9013-9561Young-Ho Gong5https://orcid.org/0000-0001-8270-7875Sung Woo Chung6https://orcid.org/0000-0001-5347-9586DRAM Design Division, Memory Solution Product Design Group, SK Hynix, Seongnam-si, Republic of KoreaDepartment of Computer Science and Engineering, Korea University, Seoul, Republic of KoreaDRAM Design Division, Memory Solution Product Design Group, SK Hynix, Seongnam-si, Republic of KoreaChair of Semiconductor Test and Reliability, University of Stuttgart, Stuttgart, GermanySchool of Electronics Engineering, Kyungpook National University, Daegu, Republic of KoreaSchool of Computer and Information Engineering, Kwangwoon University, Seoul, Republic of KoreaDepartment of Computer Science and Engineering, Korea University, Seoul, Republic of KoreaMonolithic 3D (M3D) integration reduces the wire length, which eventually improves energy efficiency and performance compared to 2D integration. However, 3D integration inevitably causes higher on-chip temperature compared to 2D integration due to the increased power density as well as worse heat dissipation. The high on-chip temperature may offset the benefits of the M3D microprocessors due to the following reasons: 1) high on-chip temperature increases leakage power, which degrades energy efficiency. 2) the actual clock frequency is limited at run-time by frequent dynamic thermal management (DTM) invocations. In this paper, for the first time, we explore the <italic>thermal feasibility</italic> (whether it is possible to achieve high energy efficiency and performance without exceeding threshold temperature) of the M3D microprocessors depending on cooling solutions. For the thermal feasibility study, we construct an integrated framework to investigate the thermal behaviors and thermal feasibility of different types of microprocessors (M3D, 2D, and through-silicon-via based 3D (TSV-3D)) with different cooling solutions. Our thermal-aware evaluation results show that the best configuration of the M3D microprocessors reduces average energy consumption by 27.6% compared to the 2D microprocessor at an iso-frequency (4.0GHz). In addition, at the highest clock frequencies satisfying both design and thermal constraints, the best configuration of the M3D microprocessors improves average system performance by 25.1% and 26.0% compared to the 2D and TSV-3D microprocessors, respectively.https://ieeexplore.ieee.org/document/9524684/Monolithic 3D integrationon-chip temperaturethermal feasibilitycooling solution |
| spellingShingle | Ji Heon Lee Young Seo Lee Jeong Hwan Choi Hussam Amrouch Joonho Kong Young-Ho Gong Sung Woo Chung Characterizing the Thermal Feasibility of Monolithic 3D Microprocessors IEEE Access Monolithic 3D integration on-chip temperature thermal feasibility cooling solution |
| title | Characterizing the Thermal Feasibility of Monolithic 3D Microprocessors |
| title_full | Characterizing the Thermal Feasibility of Monolithic 3D Microprocessors |
| title_fullStr | Characterizing the Thermal Feasibility of Monolithic 3D Microprocessors |
| title_full_unstemmed | Characterizing the Thermal Feasibility of Monolithic 3D Microprocessors |
| title_short | Characterizing the Thermal Feasibility of Monolithic 3D Microprocessors |
| title_sort | characterizing the thermal feasibility of monolithic 3d microprocessors |
| topic | Monolithic 3D integration on-chip temperature thermal feasibility cooling solution |
| url | https://ieeexplore.ieee.org/document/9524684/ |
| work_keys_str_mv | AT jiheonlee characterizingthethermalfeasibilityofmonolithic3dmicroprocessors AT youngseolee characterizingthethermalfeasibilityofmonolithic3dmicroprocessors AT jeonghwanchoi characterizingthethermalfeasibilityofmonolithic3dmicroprocessors AT hussamamrouch characterizingthethermalfeasibilityofmonolithic3dmicroprocessors AT joonhokong characterizingthethermalfeasibilityofmonolithic3dmicroprocessors AT younghogong characterizingthethermalfeasibilityofmonolithic3dmicroprocessors AT sungwoochung characterizingthethermalfeasibilityofmonolithic3dmicroprocessors |